First silicon is back

AF-R1 and AF-A1 are back from the foundry. We received 300 bare die, our first silicon.

The immediate work is packaging. Bare die become testable parts, then bring-up and electrical characterization begin. The plan is to have both parts fully characterized by the end of 2026, with results published on their product pages as they land.

We are actively looking for radiation-testing opportunities. If you run beam time, partner on test campaigns, or want early data on affordable radiation-tolerant compute, we would like to hear from you.

The next generation is already underway: AF-X1, the flagship system chip, and AF-X2, its production successor, are both in active development.